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AI NewsIntel, 3DGS Explore Advanced Semiconductor Packaging Facility in Odisha

Intel, 3DGS Explore Advanced Semiconductor Packaging Facility in Odisha

11:13 AM IST · June 1, 2026

Intel, 3DGS Explore Advanced Semiconductor Packaging Facility in Odisha

The proposed project could position Odisha as a major hub for semiconductor manufacturing, advanced packaging, AI infrastructure, and next-generation data centres.

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