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AI NewsFoundation for India’s First 3D Chip Packaging Unit Laid in Odisha

Foundation for India’s First 3D Chip Packaging Unit Laid in Odisha

6:04 PM IST · April 20, 2026

Foundation for India’s First 3D Chip Packaging Unit Laid in Odisha

The project targets AI, 5G and defence sectors, with production set to begin by 2028.

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